JPH0710510Y2 - 混成集積回路用モジュール - Google Patents
混成集積回路用モジュールInfo
- Publication number
- JPH0710510Y2 JPH0710510Y2 JP1989062526U JP6252689U JPH0710510Y2 JP H0710510 Y2 JPH0710510 Y2 JP H0710510Y2 JP 1989062526 U JP1989062526 U JP 1989062526U JP 6252689 U JP6252689 U JP 6252689U JP H0710510 Y2 JPH0710510 Y2 JP H0710510Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- module
- corners
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000576 coating method Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 13
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 230000002950 deficient Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989062526U JPH0710510Y2 (ja) | 1989-05-31 | 1989-05-31 | 混成集積回路用モジュール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989062526U JPH0710510Y2 (ja) | 1989-05-31 | 1989-05-31 | 混成集積回路用モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH032665U JPH032665U (en]) | 1991-01-11 |
| JPH0710510Y2 true JPH0710510Y2 (ja) | 1995-03-08 |
Family
ID=31591755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989062526U Expired - Lifetime JPH0710510Y2 (ja) | 1989-05-31 | 1989-05-31 | 混成集積回路用モジュール |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0710510Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53104316A (en) * | 1977-02-23 | 1978-09-11 | Shinozaki Kougeishiya Yuugen | Method of producing cover of case* binder* file or like |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0528783Y2 (en]) * | 1985-11-08 | 1993-07-23 | ||
| JPS62147526U (en]) * | 1986-03-12 | 1987-09-18 | ||
| JPS6416640U (en]) * | 1987-07-21 | 1989-01-27 |
-
1989
- 1989-05-31 JP JP1989062526U patent/JPH0710510Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH032665U (en]) | 1991-01-11 |
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